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 The W91X series is a high-throughput IC handler, which can measure two devices in parallel, and supports various package types, including SOP, SSOP and TSOP. Package types can be changed in under ten minutes using the toolless one-touch change kit.
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| Specifications |
| Target Package: |
SOP, SSOP, TSOP etc. |
| Index Time: |
0.8sec/2pcs |
| Test Mode: |
Single/Dual |
| Binning: |
Max 5 bins. |
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 Since the WS58 provides ideal test methods for testing high-voltage devices, it is capable of high-accuracy testing and high reliability using a newly-developed contact method for both sides probing wafers.
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| Features |
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High-accuracy ultra-low specific on-resistance test: Rdson < 10 m ohm (using Id=200 A) |
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Avalanche switching characteristics tests on wafers |
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 This is a double sided wafer prober, developed to be a low-cost manual driveing of the WS58. All checks, from mounting the wafer to driving the stages, including checks for the positioning of pins, the pressure of pins on the chip, and scrub mark, can be performed manually.
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| Features |
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Does not use electricity or pneumatics (All movements are performed by human operators) |
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Positioning pins on chips being tested is easy (coarse alignment of the X and Y stages can be driven at the same time) |
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Fine positioning is easy (a macrometer is used for fine alignment the X and Y stages) |
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The heights of the upper& lower blades can be fine-align individually |
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Exchanging blades is easy |
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