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 The W917 is a high-throughput IC handler, which can measure two devices in parallel, and supports various package types, including SOP, SSOP, TSOP and DIP. Package types can be changed in under ten minutes using the toolless one-touch change kit.
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| Specifications |
| Test Package: |
SOP,SSOP,TSOP,DIP,SIP etc. |
| Index Time: |
0.8sec/2pcs |
| Test mode: |
Single/Dual(Option,Quad) |
| Binning: |
Max 5 bins. |
| Temperature: |
Ambient,50-125degrees C (Option,50-155degrees C) |
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 Since the WS50 provides ideal test methods for testing high-voltage devices, it is capable of high-accuracy testing and high reliability using a newly-developed contact method for both sides probing wafers.
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| Features |
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High-accuracy ultra-low ON resistance tests (using Id=100A) |
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Avalanche switching characteristics tests on wafers |
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 This is a double side wafer prober, developed to be a low-cost manual version of the WS50. All checks, from mounting the wafer to driving the stages, including checks for the positioning of pins, the pressure of pins on the chip, and scrub mark, can be performed manually.
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| Features |
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Does not use electricity or pneumatics (All movements are performed by human operators) |
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Positioning pins on chips being tested is easy (coarse alignment of the X and Y stages can be driven at the same time) |
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Fine positioning is easy (a macrometer is used for fine alignment the X and Y stages) |
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The heights of the upper& lower blades can be fine-align individually |
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Exchanging blades is easy |
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